Printed circuit board having a land with an inwardly facing surf

Details Printed circuit board having a land with an inwardly facing surf Printed circuit board having a land with an inwardly facing surf

1994-10-31

1996-07-30

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 361767, 361760, 361808, 439 83, 257734, 257739, 29840, H05K 118

Patent

active

055413676

ABSTRACT:
A printed circuit board is provided having one or more lands formed upon the outer surface of the printed circuit board. Each land is adapted to receive a surface mount component and, specifically, leads extending from the surface mount component. Each land is fabricated having an inwardly facing exposed surface which, when the lead is placed upon the land, directs or channels the lead toward the center of the land to enhance interconnect accuracy of the lead to the land. Moreover, various configurations of solder are placed upon the land, wherein the solder can be deposited at select regions on the land or at a controlled thickness. Careful placement of solder helps ensure the lead, once placed, will not migrate or misalign from the land during subsequent reflow. Careful placement of solder helps minimize surface tension imbalance of the molten solder by assuring surface migration in a controlled direction to the middle of the land.

REFERENCES:
patent: 4254448 (1981-03-01), Martyniak
patent: 4976626 (1990-12-01), Dibble et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5373111 (1994-12-01), McClure et al.
patent: 5410807 (1995-05-01), Bross et al.
Printed Circuits Handbook, Clyde F. Coombs, Jr., McGraw-Hill Company, Third Edition pp. 12.11-12.13.

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