Multilayer circuit board having microporous layers and method fo

Details Multilayer circuit board having microporous layers and method fo Multilayer circuit board having microporous layers and method fo

1992-11-10

1994-10-11

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428457, 428901, 428913, 430313, 361748, 174 681, B32B 900

Patent

active

053545931

ABSTRACT:
A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

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patent: 4597828 (1986-07-01), Tadroi
patent: 4642160 (1987-02-01), Burgess
patent: 4666818 (1987-05-01), Lake et al.
patent: 4774279 (1988-09-01), Kohm
patent: 4954185 (1990-09-01), Kohm
Malhotra et al., Hewlett-Packard Journal (Aug. 1983).

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