Method of manufacture of surface acoustic wave device

Details Method of manufacture of surface acoustic wave device Method of manufacture of surface acoustic wave device

1998-03-09

1999-11-30

Hall, Carl E.

Metal working

Piezoelectric device making

310313R, H01L 4122

Patent

active

059919892

ABSTRACT:
A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps, and the protective means.

REFERENCES:
patent: 4270105 (1981-05-01), Parker et al.
patent: 4699682 (1987-10-01), Takishima
patent: 5448126 (1995-09-01), Eda et al.
patent: 5453652 (1995-09-01), Eda et al.
patent: 5471722 (1995-12-01), Yatsuda
Kazuo Eda , Ke.ji Ohnishi et al., "Flip-Chip Bonding Technology Fabricates GHz-Band SAW Filters," JEE Journal of Electronic Engineering, No. 324, (Dec. 1993), 4 pp.
European Search Report No. 96107281.6 (Sep. 5, 1996).

Affiliated with

Also associated with

Rating

Method of manufacture of surface acoustic wave device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacture of surface acoustic wave device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacture of surface acoustic wave device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1657174