Soldering apparatus

Details Soldering apparatus Soldering apparatus

1987-12-15

1989-07-18

Rowan, Kurt

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

118410, 118429, B23K 3102, B23K 108

Patent

active

048486426

ABSTRACT:
An apparatus for soldering printed circuit boards moving along a predetermined path of travel, comprises an upwardly extending nozzle member having an opening at its top end from which molten solder is caused to overflow to form an overflowing molten solder with which the underside surface of the printed circuit board is contacted, and an adjustable outlet member rotatably disposed in the opening to define an outlet extending in the direction transverse to the path of travel, so that by adjusting the angular position of the outlet member the orientation of the outlet may be varied for adjustment of the direction and height of the overflowing solder.

REFERENCES:
patent: 3119363 (1964-01-01), Rieben
patent: 3398873 (1968-08-01), Wegener
patent: 4465014 (1984-08-01), Bajka
patent: 4512508 (1985-04-01), Pachschwoll
patent: 4530457 (1985-07-01), Down
patent: 4530458 (1985-07-01), Kondo
patent: 4659003 (1987-04-01), Simonetti
patent: 4666077 (1987-05-01), Rahn
patent: 4679720 (1987-07-01), Sedrick
patent: 4684056 (1987-08-01), Deambrosio

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