Process for producing electronic part with laminated substrates

Details Process for producing electronic part with laminated substrates Process for producing electronic part with laminated substrates

1998-08-14

2000-03-14

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156150, 264666, H03H 0300, H05K 0346

Patent

active

060367989

ABSTRACT:
An electronic part having a plurality of substrates and a process for producing the same are disclosed, the electronic part comprising (1) a laminate comprising at least two previously fired substrates different in electrical characteristics each containing in the inside thereof a passive element, and an adhesive layer comprising glass which is interposed between said substrates, and (2) an outer electrode which is formed on the surface of the laminate of the substrates and is electrically connected to the passive elements, and the process comprising the steps of: separately firing at least two substrates different in electrical characteristics each containing in the inside thereof a passive element; adhering the substrates with an adhesive comprising glass; and forming an outer electrode on the surface of the laminate of the substrates in electrical connection to each passive element. Each substrate is free from warpage or cracking and containing no part remaining non-sintered.

REFERENCES:
patent: 3634785 (1972-01-01), Kameya
patent: 4322698 (1982-03-01), Takahashi et al.
patent: 4342143 (1982-08-01), Jennings
patent: 4437140 (1984-03-01), Ohyama et al.
patent: 4555291 (1985-11-01), Tait et al.
patent: 4714905 (1987-12-01), Bernstein et al.
patent: 5834835 (1998-11-01), Maekawa

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