Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-07-09
1994-10-11
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
437183, 437209, H05K 334
Patent
active
053534980
ABSTRACT:
Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
REFERENCES:
patent: 3903590 (1975-09-01), Yokogawa
patent: 4466181 (1984-08-01), Takishima
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 5019946 (1991-05-01), Eichelberger et al.
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5091769 (1992-02-01), Eichelberger et al.
patent: 5108825 (1992-04-01), Wojnarowski et al.
patent: 5139969 (1992-08-01), Mori
patent: 5144747 (1992-09-01), Eichelberger et al.
patent: 5151776 (1992-09-01), Wojnarowski et al.
patent: 5154793 (1992-10-01), Wojnarowski et al.
patent: 5155068 (1992-10-01), Tada
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5255431 (1993-10-01), Burdick
Cole Herbert S.
Daum Wolfgang
Fillion Raymond A.
Gdula Michael
Wildi Eric J.
Arbes Carl J.
General Electric Company
Krauss Geoffrey H.
LandOfFree
Method for fabricating an integrated circuit module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating an integrated circuit module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating an integrated circuit module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1650022