Semiconductor sensor including protective resin package

Details Semiconductor sensor including protective resin package Semiconductor sensor including protective resin package

1996-01-02

1998-07-21

Oda, Christine K.

Measuring and testing

Speed, velocity, or acceleration

Structural installation or mounting means

73727, G01P 102

Patent

active

057837481

ABSTRACT:
A semiconductor sensor provided with a planar circuit board and a resin package for protecting the circuit board. Further, a sensing element is mounted on the circuit board and outer electrodes are attached to a side edge portion of the circuit board. Moreover, includes the resin package, a groove, in which the circuit board is disposed. Thus the semiconductor sensor can be easily fabricated. Consequently, the manufacturing cost of a product or sensor can be reduced.

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patent: 4838089 (1989-06-01), Okada et al.
patent: 5233873 (1993-08-01), Mozgowiec et al.
patent: 5257547 (1993-11-01), Boyer
patent: 5554806 (1996-09-01), Mizuno et al.

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