Laminated printed circuit board and process for its manufacture

Details Laminated printed circuit board and process for its manufacture Laminated printed circuit board and process for its manufacture

1988-11-21

1990-03-27

Ryan, Patrick

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156228, 156288, 1563063, 156901, 264104, B31B 160

Patent

active

049117718

ABSTRACT:
A process is provided for making a laminated board useful in printed circuitry. The process involves laminating a metal layer to at least one side of a sheet of porous, expanded polytetrafluoroethylene using an adhesive followed by compressing the polytetrafluoroethylene sheet to increase its density. The metal layer may be a metal foil or it may comprise electrical circuitry. Also provided are printed circuit boards produced by the aforesaid process.

REFERENCES:
patent: 4640866 (1987-02-01), Suzuki
patent: 4680220 (1987-07-01), Johnson
patent: 4772509 (1988-09-01), Komada et al.
patent: 4781969 (1988-11-01), Kobayashi et al.
patent: 4984901 (1988-11-01), Hatakeyama et al.

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