Die-stamped circuit board assembly having relief means-method of

Details Die-stamped circuit board assembly having relief means-method of Die-stamped circuit board assembly having relief means-method of

1980-03-19

1982-03-23

Gilden, Leon

Metal working

Method of mechanical manufacture

Electrical device making

29845, 29622, 156251, 156261, H01H 1100

Patent

active

043205720

ABSTRACT:
A photoflash device circuit board assembly including a dielectric substrate and at least one switching element and conductor die-stamped therein. To assure that the delicate switch is not severed by the die's cutting edge during die-stamping, a relief means (e.g., slot) is provided within the substrate so that a segment of the switch can be aligned therewith. As an alternative, it is taught to provide stepped portions within the die's cutting edge to align with preselected portions of the switch and thus prevent total severance thereof.

REFERENCES:
patent: 3857667 (1974-12-01), Vetere et al.
patent: 3911716 (1975-10-01), Weglin
patent: 3990142 (1976-11-01), Weglin
patent: 4017728 (1977-04-01), Audesse
patent: 4113424 (1978-09-01), Armstrong
patent: 4152751 (1979-05-01), Sindlinger
patent: 4164007 (1979-08-01), Audesse et al.

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