Semiconductor device having semiconductor chip mounted in packag

Details Semiconductor device having semiconductor chip mounted in packag Semiconductor device having semiconductor chip mounted in packag

1995-08-07

1998-07-21

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

257683, 257704, H01L 2144

Patent

active

057834261

ABSTRACT:
The semiconductor device disclosed has a cap in which, at an undersurface periphery portion, a plurality of looped projections are formed for intercepting a continuous bubble path that may be formed for a gas to escape. The preparatory stage steps of assembling the device includes forming a plated layer on a lead frame, adhesively fixing the lead frame on a base plate, cutting and separating leads from the lead frame, and shaping the leads into a predetermined form. The assembling stage steps of the device includes mounting a semiconductor chip on the base plate and bonding electrodes on the semiconductor chip and the leads, and mounting the cap which has the looped projections for intercepting a continuous bubble path that may be formed for a gas to escape. Since the steps such as forming a plated layer and shaping the leads have been completed in the preparatory stage, the assembling steps which include the mounting of the cap having the looped projections can be efficiently carried out.

REFERENCES:
patent: 5256901 (1993-10-01), Ohashi et al.
patent: 5278429 (1994-01-01), Takenaka et al.
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5468910 (1995-11-01), Knapp et al.
patent: 5629562 (1997-05-01), Nomura et al.

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