Method of preparing substrate surface for electroless plating an

Details Method of preparing substrate surface for electroless plating an Method of preparing substrate surface for electroless plating an

1979-01-22

1980-11-04

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

106 111, 427304, 427305, 427437, 427438, C23C 302

Patent

active

042320607

ABSTRACT:
Polyalloy catalytic coating formulations are used for preparing a metallic substrate surface to enhance subsequent plating thereover of nickel, cobalt or polyalloys including nickel or cobalt. At the same time, these catalytic formulations can be rinsed subsequent to their application onto the substrate and prior to the electroless deposition thereover. Improved products such as printed wiring boards may be made with these catalytic formulations. Such boards are prepared by depositing metal and forming circuitry patterns by using resists, etching techniques and the like which typically leave copper specks on the non-conductive board. The invention discourages electroless deposition by a nickel-containing plating bath over embedded copper specks, thereby reducing the possibility of developing bridging within the circuitry and in general undesirably increasing the conductivity of the board at locations other than on the circuitry pattern to produce printed wiring boards that are extremely resistant to developing short circuiting problems.

REFERENCES:
patent: 3226256 (1965-12-01), Schneble, Jr. et al.
patent: 3431120 (1969-03-01), Weisenberger
patent: 3832168 (1974-08-01), Gulla
patent: 3959523 (1976-05-01), Grunwald et al.
patent: 4002778 (1977-01-01), Bellis et al.
patent: 4019910 (1977-04-01), Mallory
patent: 4020197 (1977-04-01), Steffen
patent: 4122215 (1978-10-01), Vratny
patent: 4136216 (1979-01-01), Feldstein
Pearlstein, "Electroless Plating", Modern Electroplating, John Wiley & Sons, pp. 710-729, c 1974.

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