Optical diebonding for semiconductor devices

Details Optical diebonding for semiconductor devices Optical diebonding for semiconductor devices

1996-11-06

1998-07-21

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

1563798, 1563809, 156382, 156497, 219 8512, 2505051, 392408, B32B 3100, G05G 1500

Patent

active

057830258

ABSTRACT:
Semiconductor die attach occurs by bonding the semiconductor die to a support member such as a lead frame. An optical heat source provides heat for bonding the die attach material. An exhaust system removes vapors from the die attach material during bonding. A tungsten halogen lamp is an exemplary optical heat source. An air amplifier is exemplary to provide exhaust pressure. An exhaust manifold having a plurality of screens spreads the exhaust pressure over the width of the lead frame. A gas shower disposed over the lead frame aids in removing vapors.

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