Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Patent
1998-10-20
2000-11-07
Monin, Jr., Donald L.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
438 64, 438462, 257434, 257790, H01L 2328
Patent
active
061435880
ABSTRACT:
A method of making an integrated circuit package for EPROM, CCD, and other optical integrated circuit devices is disclosed. First, a substrate base having metallized vias extending there through is provided. Second, an integrated circuit die is affixed to a first surface of the substrate, and is electrically connected to the metallized vias. Third, a bead of a viscous adhesive material is applied onto the substrate around the device. The bead covers the side surfaces of the device, the periphery of the upper first surface of the device, and the bond wires. The bead and the upper first surface of the die form a cavity above the die. Fourth, a layer of a transparent encapsulating material is deposited onto the die, within the cavity formed by the bead. Fifth, the encapsulating material is hardened, and subsequently forms an exterior surface of the package. The transparent encapsulating material allows light to illuminate the light sensitive circuitry of the device.
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Amkor Technology Inc.
Dietrich Mike
Monin, Jr. Donald L.
Parsons James E.
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