Method of constructing a number of different memory systems

Details Method of constructing a number of different memory systems Method of constructing a number of different memory systems

1979-07-16

1981-03-17

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, H05K 332

Patent

active

042558522

ABSTRACT:
A printed circuit board assembly includes at least two layers which is able to accommodate a subsystem such as a memory subsystem designed to have one or more optional features. The two layers of the printed circuit board when etched include the required number of horizontal and vertical paths to be connected to all of the integrated circuit chips to be positioned and interconnected thereon. The required holes for such integrated circuit chips when drilled include first sets of holes for mounting groups of integrated circuit chips required for implementing a first group of features and which are to be interconnected to the other integrated circuit chips of the subsystem mounted on the different sections of the board. Second sets of holes are included on the board so as to have a predetermined relationship with the first sets of holes for mounting alternative groups of integrated circuit chips to be interconnected in a manner to implement other features. Thereafter, the circuit board is populated with only those integrated circuit chips required for construction of a memory subsystem with one or more selected features.

REFERENCES:
patent: 3078443 (1963-02-01), Rose
patent: 3564114 (1971-02-01), Blinder
patent: 3751645 (1973-08-01), Brandsma et al.
patent: 3867760 (1975-02-01), Horecky et al.
patent: 3917984 (1975-11-01), Kong et al.

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