Electronic chip package

Details Electronic chip package Electronic chip package

1998-01-16

2000-11-07

Lam, Cathy F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having a component wherein a constituent is liquid...

4283084, 4283171, 428325, 428344, 428421, 428901, 174255, 174258, 174259, 257702, 257703, 257705, 257729, B32B 326

Patent

active

061434019

ABSTRACT:
An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature T.sub.g greater than 200.degree. C. and a volumetric coefficient of thermal expansion of .ltoreq.75 ppm/.degree.C. A semiconductor device is electrically attached to the laminated substrate.

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