Signal transfer circuit for use in laminated multilayer electric

Details Signal transfer circuit for use in laminated multilayer electric Signal transfer circuit for use in laminated multilayer electric

1986-07-14

1988-02-02

Heyman, John S.

Electrical transmission or interconnection systems

Nonlinear reactor systems

Parametrons

307303, 307443, 307451, 307555, 361393, 357 51, 357 75, H03K 19017, H03K 19094

Patent

active

047230827

ABSTRACT:
A laminated multilayer electric circuit is comprised of wafers having each internal electric circuits and laminated one after another. A signal transfer circuit used in the laminated multilayer electric circuit for transfer of signals between the wafers through an electrostatic capacitor has a receiving circuit of sufficiently high input resistance for receiving a signal from a capacitance electrode forming the electrostatic capacitor, and a circuit for clamping the level of the signal substantially within the input amplitude for the receiving circuit. The signal transfer circuit permits the signal transfer to be performed not through a flip-flop or the like and consequently at high speeds.

REFERENCES:
patent: 3953748 (1976-04-01), Sugiur et al.
patent: 4002928 (1977-01-01), Goser et al.
patent: 4288751 (1981-09-01), Yoshida et al.
patent: 4438352 (1984-03-01), Mardkha
patent: 4508981 (1985-04-01), Dorler et al.
patent: 4558239 (1985-12-01), Kim et al.

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