Process and manufacturing tool architecture for use in the manuf

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

118719, 414935, C23C 1600, C23F 102

Patent

active

061431265

ABSTRACT:
A manufacturing tool configuration for applying one or more levels of interconnect metallization to a generally planar dielectric surface of a workpiece with a minimal number of workpiece transfer operations between the tool sets is disclosed. The tool configuration comprises a film deposition tool set, a pattern processing tool set, a wet processing tool set, and a dielectric processing tool set.

REFERENCES:
patent: 5256204 (1993-10-01), Wu
patent: 5563095 (1996-10-01), Frey
patent: 5611861 (1997-03-01), Itigashi
patent: 5882165 (1999-03-01), Magdan et al.

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