IC socket for a BGA package

Details IC socket for a BGA package IC socket for a BGA package

1997-11-04

2000-03-14

Nguyen, Khiem

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439266, 439 66, H01R 909

Patent

active

06036503&

ABSTRACT:
A plurality of contact pins are embedded in a socket body having at least two mutually opposing parallel surfaces so as to correspond to the arrangement of a plurality of ball bumps of a BGA package. The tips of the plurality of contact pins protrude from one of the two parallel surfaces. A flat guide plate having a plurality of holes matched the arrangement and shape of the plurality of ball bumps, is elastically supported so as to be in a floating state with respect to the surface penetrated by the plurality of contact pins. And the flat guide plate houses a tip of one of the plurality of contact pins in each of the holes. The rim of the opening of each hole is in a tapered form so as to guide the center of a ball bump to within the limits of the outer form of the tip of a contact pin.

REFERENCES:
patent: 5388998 (1995-02-01), Grange et al.
patent: 5518410 (1996-05-01), Masami
patent: 5570033 (1996-10-01), Staab
patent: 5727954 (1998-03-01), Kato et al.
patent: 5791914 (1998-08-01), Loranger et al.
patent: 5800194 (1998-09-01), Yamagishi

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