Semiconductor device assembly carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

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Details

257678, H01L 2304

Patent

active

052784479

ABSTRACT:
Damage to the package body and external leads of a leaded semiconductor device assembly is prevented by a carrier assembly. The carrier assembly includes a rigid bottom (lower) plate positively supporting the package body and providing a bottom cover for the external leads. A semi-rigid top (upper) plate positively holds the package body against the bottom plate, prevents movement of the package body with respect to the carrier assembly, and covers the external leads. Fasteners are provided for securing the upper plate to the lower plate, preferably at the four corners of the plates. In this manner, a durable "sandwich" structure is created, with the package disposed between the lower and upper plates and the body and leads well protected against damage.

REFERENCES:
patent: 3940786 (1976-02-01), Scheingold et al.
patent: 4007479 (1977-02-01), Kowalski
patent: 4692790 (1987-09-01), Oyamada
patent: 5038248 (1991-08-01), Meyer
patent: 5065279 (1991-11-01), Lazenby et al.

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