Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1998-10-15
2000-11-07
Ryan, Patrick
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 21, 228 37, 228 40, 118406, B23K 3706, B23K 108, B05C 310, B05C 1706
Patent
active
061423572
ABSTRACT:
A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.
REFERENCES:
patent: 3616984 (1971-11-01), Voroba
patent: 3749485 (1973-07-01), Carter et al.
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4604966 (1986-08-01), Kohn
patent: 4614294 (1986-09-01), Weaver
patent: 4682723 (1987-07-01), Grummett
patent: 4720034 (1988-01-01), Lee
patent: 4739919 (1988-04-01), Van Den Breckel et al.
patent: 4801065 (1989-01-01), Colquitt et al.
patent: 5148961 (1992-09-01), Humbert et al.
patent: 5617990 (1997-04-01), Thompson, Sr.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5767424 (1998-06-01), Breunsbach et al.
patent: 5950304 (1999-09-01), Khandros et al.
patent: 5965944 (1999-10-01), Frankoski et al.
Cooke Colleen J.
Korfanta Craig M.
MCMS Inc.
Ryan Patrick
LandOfFree
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