Machine and method for stripping photoresist from wafers

Cleaning and liquid contact with solids – Apparatus – Sequential work treating receptacles or stations with means...

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134122R, 134131, 134 94, 198626, B08B 308

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047223553

ABSTRACT:
Photoresist baked upon integrated circuit wafers is mechanically stripped therefrom. Wafers are unloaded from boats at the top of an elevator within a vertical housing filled with stripper solution, then deposited on a conveyor and carried through a horizontal housing also filled with stripper. The wafers are sprayed by high pressure stripper pumped through a nozzle at the end of their horizontal travel. The wafers are then transferred to another housing where they are rinsed, dried and, optionally, reloaded.

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