Method for electrically connecting an electrode and impurity-dif

Fishing – trapping – and vermin destroying

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437 52, 257377, 257382, 257903, H01L 21265

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active

052780821

ABSTRACT:
A method for producing a semiconductor device in which an electrode and an impurity-diffused layer formed on a semiconductor substrate are electrically connected to each other, includes the following steps: forming a first insulating film on the semiconductor substrate; forming a first mask layer on the first insulating film, and forming a second mask layer on the first mask layer, the first mask layer comprising a first opening for exposing a part of the surface of the semiconductor substrate, the second mask layer comprising a second opening, at least the exposed part of the surface of the semiconductor substrate being exposed by the second opening; removing at least a part of the first insulating film exposed through the first opening; implanting a first impurity into the semiconductor substrate using the second mask layer as a mask and employing an acceleration energy at which the first impurity can pass through the first mask layer; removing the second mask layer, and forming the electrode doped with a second impurity so as to entirely cover the first opening; implanting a third impurity into the semiconductor substrate using the electrode as a mask; and activating the first impurity and the third impurity by annealing the semiconductor substrate, and diffusing the second impurity from the electrode to the semiconductor substrate by annealing the semiconductor substrate by annealing the semiconductor substrate, thereby forming the impurity-diffused layer.

REFERENCES:
patent: 4374700 (1983-02-01), Scott et al.
patent: 4560582 (1985-12-01), Ichikawa
patent: 4794563 (1988-12-01), Maeda
patent: 4985746 (1991-01-01), Asahina
patent: 5173450 (1992-12-01), Wei
patent: 5204279 (1993-04-01), Chan et al.
patent: 5210042 (1993-05-01), Oshikawa
patent: 5219779 (1993-06-01), Suzuki

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