Process for producing printed circuit boards

Details Process for producing printed circuit boards Process for producing printed circuit boards

1983-04-15

1984-07-03

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427259, 427306, C23C 302, H05K 318

Patent

active

044579527

ABSTRACT:
When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.

REFERENCES:
patent: 3534147 (1970-10-01), Bratton
patent: 3546011 (1970-12-01), Knorre
patent: 4099974 (1978-07-01), Morishita
patent: 4151313 (1979-04-01), Wajima
patent: 4212912 (1980-07-01), Nartusch
patent: 4311749 (1982-01-01), Hirgiwa

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