Process for producing wiring circuit board

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

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Details

204192D, 427 99, 427124, 4271264, 427256, 427265, B05D 306

Patent

active

044579500

ABSTRACT:
A wiring circuit board with a fine wiring pattern free from disconnection and poor insulation is produced by forming an insulating layer consisting of at least two insulating substances having different dissociation energies for metalization, including metal elements, on a substrate and irradiating the insulating layer with an energizing beam by scanning, thereby forming a wiring pattern as desired.

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