Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1982-06-15
1984-07-03
Newsome, John H.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
313384, 313385, 427 86, 4273722, B05D 314, B05D 512
Patent
active
044579497
ABSTRACT:
A hydrogen-containing amorphous silicon layer is formed on a substrate held below 200.degree. C., in a plasma atmosphere, whereupon the plasma is stopped and the layer is heated in a temperature range of 200.degree. C.-400.degree. C. without cooling the substrate. The saturation field for photocurrent of electrons or holes can be made low. In case of using electrons as major carriers, preferably the heating temperature is set in a temperature range of 200.degree. C.-240.degree. C., and in case of using holes as major carriers, preferably it is set in a range of 270.degree. C.-400.degree. C.
REFERENCES:
patent: 4255686 (1981-03-01), Maruyama et al.
Yamamoto et al., "Proceedings of the 12th Conf. on Solid State Devices, Tokyo 1980" Japanese Journal of Applied Physics, vol. 20, (1981) Supplement 20-1, pp. 305-310.
Chittick et al., "J. Electrochem. Soc. Solid State Science", vol. 116, No. 1, Jan. 1969.
Sasano Akira
Shimomoto Yasuharu
Takasaki Yukio
Tanaka Yasuo
Tsukada Toshihisa
Hitachi , Ltd.
Newsome John H.
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