Bright field wafer target

Details Bright field wafer target Bright field wafer target

1993-03-25

1994-05-31

Quach, T. N.

Fishing, trapping, and vermin destroying

437225, 437228, 437924, 148DIG102, 148 33, 148 332, 356401, H01L 2130, G03F 900

Patent

active

053169840

ABSTRACT:
A composite target used in alignment of layers on a wafer uses alignment marks placed in a target area. First alignment marks are composed of material from a first layer placed on the wafer. As subsequent layers are placed on the wafer, alignment marks composed of material from the subsequent layers are placed within the target area. For example, alignment marks composed of material from a second layer are each placed adjacent to one of the alignment marks composed of material from the first layer. Alignment marks composed of material from a third layer are each placed adjacent to one of the alignment marks composed of material from the second layer. Alignment marks composed of material from a fourth layer are each placed adjacent to the alignment marks composed of material from the third layer. And so on. The alignment marks are, for example, each rectangular in shape.

REFERENCES:
patent: 4118230 (1978-10-01), Binder
patent: 4824254 (1989-04-01), Ohtsuka et al.

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