Method for affixing spacers within a flat panel display

Electric lamp and discharge devices – With luminescent solid or liquid material – Vacuum-type tube

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445 24, H01J 924

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active

058119272

ABSTRACT:
A method for affixing a plurality of spacers (102) within a field emission display (160) is disclosed. The method includes the steps of: (i) providing a plurality of members (104), (ii) coating an edge (106) of each of the plurality of members (104) with a metal to provide a bonding layer (108), (iii) forming a metallic bonding pad (132) on the inner surface of an anode (120) to provide a modified anode (130), (iv) affixing a plurality of metallic compliant members (112) to the bonding layer (108) by using ball bonding techniques, and (v) affixing the metallic compliant members (112) to the metallic bonding pad (132), while positioning the spacer (102) perpendicularly with respect to the modified anode (130), by using thermocompression metal bonding techniques.

REFERENCES:
patent: 5232549 (1993-08-01), Cathey et al.
patent: 5717287 (1998-02-01), Amrine et al.
Cathryn E. Goodman et al., "A Novel Multichip Module Assembly Approach Using Gold Ball Flip-Chip Bonding", IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. 15, No. 4, Aug. 1992, pp. 457-464.

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