Plastic-molded semiconductor device

Details Plastic-molded semiconductor device Plastic-molded semiconductor device

1987-09-03

1991-04-23

Prenty, Mark

357 70, 357 68, 357 80, H01L 2328, H01L 2348

Patent

active

050103903

ABSTRACT:
A plastic-molded semiconductor device comprises a semiconductor pellet having an insulating substrate and an integrated circuit formed on the insulating substrate, and a pellet mounting member on which the semiconductor pellet is mounted. The pellet mounting member is not provided with any conductive portion at least under the center of the insulating substrate. The distance between the interconnection layer of the integrated circuit and the conductive portion of the pellet mounting member is relatively long, so the semiconductor device has a small parasitic capacitance. This results in a high speed and a low power dissipation.

REFERENCES:
patent: 3864820 (1975-02-01), Brennan et al.
patent: 3878555 (1975-04-01), Freitag et al.
patent: 4142203 (1979-02-01), Dietz
patent: 4301464 (1981-11-01), Otsuki et al.
Japanese Journal of Applied Physics, vol. 18, Supplement 18-1, pp. 63-69 by Iwamura et al. (1979).
Microelectronics Packaging Handbook by Tummula, pp. 530-531, 1989.

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