Insulator separated vertical CMOS

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 41, 357 55, 357 234, 357 236, 357 237, H01L 2702, H01L 2906, H01L 2910, H01L 2701

Patent

active

050103865

ABSTRACT:
A complementary semiconductor structure comprises a substrate of a first conductivity type upon which a first channel layer of a second conductivity type is formed. The first source/drain layer of the first conductivity type is formed on the surface of the first channel layer and an insulating layer is formed on the surface of the first source/drain layer. A second source/drain layer of the second conductivity type is formed on the surface of the insulating layer and a second channel layer of said first conductivity is formed on the surface of the second source/drain layer. A third source/drain layer of the second conductivity type is formed on the surface of the second channel layer. Gate circuitry is vertically disposed on an edge perpendicular to the plane and adjacent to the first and second channel layers and insulated therefrom.

REFERENCES:
patent: 4450466 (1984-05-01), Nishizawa et al.
patent: 4740826 (1988-04-01), Chatterjee
patent: 4810906 (1989-03-01), Shah et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Insulator separated vertical CMOS does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Insulator separated vertical CMOS, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Insulator separated vertical CMOS will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1624576

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.