Encapsulation of electronic device

Details Encapsulation of electronic device Encapsulation of electronic device

1981-06-04

1983-01-25

Lowe, James B.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, 26427218, 26427219, 26432818, 26433112, 525474, 525523, 525534, 525537, B29C 600

Patent

active

043702929

ABSTRACT:
An encapsulation of an electronic device is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1:4 to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 wt. parts of polyphenylene sulfide by a transfer molding process or an injection molding process.

REFERENCES:
patent: 3839301 (1974-10-01), Scoqqins
patent: 3941751 (1976-03-01), Breslow
patent: 3998767 (1976-12-01), Walton
patent: 4021596 (1977-05-01), Bailey
"Materials for Electronics", Electronics, Oct. 56, pp. 188-191.

Affiliated with

Also associated with

Rating

Encapsulation of electronic device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation of electronic device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation of electronic device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1623446