Soldering apparatus and method of using the same

Details Soldering apparatus and method of using the same Soldering apparatus and method of using the same

1989-02-15

1991-04-23

Miller, Jr., George H.

Electric heating

Metal heating

For bonding with pressure

219119, 219233, 219238, B23K 102, B23K 1130, H05B 342

Patent

active

050102273

ABSTRACT:
A soldering apparatus includes a holding device, which is composed of a ceramic material and fits over and covers partially, a thermod having an electrically grounded conductor portion to distribute heat uniformly to a soldering surface. The soldering apparatus is moved so that the thermod engages the surface to be soldered. Thermal energies are then uniformly transferred by the thermod to heat the connecting joint to soldering temperature and for heating a solder bead for soldering purposes. After soldering, the apparatus is retracted, or the current is turned off, to permit the surface to cool.

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