Semiconductor device including a resilient bonding resin

Details Semiconductor device including a resilient bonding resin Semiconductor device including a resilient bonding resin

1988-03-30

1990-02-20

James, Andrew J.

357 68, H01L 2158, H01L 2178

Patent

active

049031180

ABSTRACT:
A semiconductor device comprising a semiconductor chip attached to a substrate by two kinds of bonding agents, one of which is rigid and disposed at the central region of the semiconductor chip, the other of which is disposed around the rigid bonding agent and which is sufficiently resilient to accommodate thermal expansion differences between the semiconductor chip and the substrate.

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Bolger et al., "Die Attach in Hi-Rel . . . Epoxies?", IEEE Proceedings of Electronic Components Conference, 1984, p. 63.
Bolger et al., "Failure Mechanisms for . . . Encapsulated I.C's", IEEE Proceedings of Electronic Components Conference, 1983, p. 227.

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