Resin-molded semiconductor

Details Resin-molded semiconductor Resin-molded semiconductor

1988-06-15

1990-02-20

Hille, Rolf

357 74, 357 75, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

049031147

ABSTRACT:
A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.

REFERENCES:
patent: 4208698 (1980-06-01), Narasimhan

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