Semiconductor sensor with sealed package

Details Semiconductor sensor with sealed package Semiconductor sensor with sealed package

1995-10-10

1997-08-12

Chapman, John E.

Measuring and testing

Speed, velocity, or acceleration

Structural installation or mounting means

7351401, 73756, G01P 1508

Patent

active

056567766

ABSTRACT:
A semiconductor sensor in a sealed cap package includes a sensing device for transducing a physical quantity into an electrical signal, a stem on which the sensing device is mounted, the stem including through holes in which electrically conducting leads are respectively mounted with electrically insulating sealing members, a cap covering the sensing device and mounted on the stem, and at least one rod extending from a back surface of the stem parallel to the leads for securing the semiconductor sensor to a mount.

REFERENCES:
patent: 4499773 (1985-02-01), Crampton et al.
patent: 4898031 (1990-02-01), Oikawa et al.
patent: 5233871 (1993-08-01), Schwarz et al.
patent: 5349234 (1994-09-01), DesJardin et al.

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