Apparatus for reducing damage to wafer cutting blades during waf

Details Apparatus for reducing damage to wafer cutting blades during waf Apparatus for reducing damage to wafer cutting blades during waf

1996-11-26

1998-09-22

Eley, Timothy V.

Stone working

Work supports

125 12, 451 41, B28D 704

Patent

active

058099875

ABSTRACT:
A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer. Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.

REFERENCES:
patent: 3004766 (1961-10-01), Bryant
patent: 3690780 (1972-09-01), Bjelland et al.
patent: 3809050 (1974-05-01), Chough et al.
patent: 3811182 (1974-05-01), Ryan, Sr. et al.
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4138304 (1979-02-01), Gantley
patent: 4521995 (1985-06-01), Sekiya
patent: 4597228 (1986-07-01), Koyama et al.
patent: 4625463 (1986-12-01), Sekiya
patent: 4808406 (1989-02-01), Pikington et al.
patent: 5029418 (1991-07-01), Bull
patent: 5203547 (1993-04-01), Marumo
patent: 5410791 (1995-05-01), Wirth et al.
patent: 5445559 (1995-08-01), Gale et al.
patent: 5451549 (1995-09-01), Oki et al.
patent: 5527744 (1996-06-01), Mignardi et al.
patent: 5605489 (1997-02-01), Gale et al.

Affiliated with

Also associated with

Rating

Apparatus for reducing damage to wafer cutting blades during waf does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for reducing damage to wafer cutting blades during waf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for reducing damage to wafer cutting blades during waf will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1614046