Socket, connection system and method of making

Details Socket, connection system and method of making Socket, connection system and method of making

1988-07-20

1990-02-20

Bradley, P. Austin

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 73, 439 82, 439525, 439526, 439931, 439876, 439 83, 29876, H01R 909, H05K 100

Patent

active

049022350

ABSTRACT:
A socket for mounting an integrated circuit unit on a printed circuit board comprises a plurality of inserts of a platable electrically insulating material each having an opening and an exterior surface portion. The inserts are mounted in rows in a support body so the openings are accessible from one side of the body and the exterior surface portions are exposed at an opposite side of the body. Electrically conductive layers are provided on the inner surfaces of the insert openings, preferably by electroless plating techniques using the body as a plating mask, to extend to the exterior surface portions of the inserts to be soldered to circuit paths on the printed circuit board at prescribed circuit locations. Contacts are disposed in the insert openings in electrical engagement with the electrically conductive layers therein for resiliently and detachably electrically engaging terminals of integrated circuit units or the like inserted into the openings.

REFERENCES:
patent: 3346775 (1967-10-01), Christiansen
patent: 4083623 (1978-04-01), Lynch
patent: 4257667 (1981-03-01), Tantorno
patent: 4614388 (1986-09-01), Powell

Affiliated with

Also associated with

Rating

Socket, connection system and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Socket, connection system and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket, connection system and method of making will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1613283