Epoxy resin composition for encapsulation of semiconductor devic

Details Epoxy resin composition for encapsulation of semiconductor devic Epoxy resin composition for encapsulation of semiconductor devic

1986-05-21

1987-10-20

Lieberman, Allan M.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523443, 523444, C08K 324, C08K 906, C08L 6300

Patent

active

047014822

ABSTRACT:
An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.

REFERENCES:
patent: 4082719 (1978-04-01), Liles et al.
patent: 4125510 (1978-11-01), Antonen

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