Position detecting method with observation of position detecting

Details Position detecting method with observation of position detecting Position detecting method with observation of position detecting

1996-04-30

1998-10-27

Nuzzolillo, M.

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

430 22, 356401, 2505593, G03C 500

Patent

active

058276297

ABSTRACT:
A wafer with an exposure surface and an exposure mask are disposed, directing the exposure surface to the exposure mask with a gap being interposed therebetween, the wafer having a position aligning wafer mark formed on the exposure surface, the wafer mark having a linear or point scattering source for scattering incident light, and the exposure mask having a position aligning mask mark having a linear or point scattering source for scattering incident light. A relative position of the wafer and exposure mask is detected by applying illumination light to the wafer mark and mask mark and observing scattered light from the scattered sources of the wafer mark and mask mark.

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"Impact of Different X-Ray Mask Substrate Materials on Optical Alignment", R.I. Fuentes, C. Progler, S. Bukofsky and K. Kimmel, J. Vac. Sci. Technol. B 10(6), Nov./Dec. 1992, pp. 3204-3207.

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