Method and apparatus for grinding wafers

Details Method and apparatus for grinding wafers Method and apparatus for grinding wafers

1997-12-15

1998-10-27

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

451 10, 451 41, 451 56, 451286, 451449, 125 1122, B24B 4918

Patent

active

058271120

ABSTRACT:
A grinding machine for grinding a wafer includes a pressure sensing grinding wheel and a source of wheel dressing. Based on a pressure signal received from the grinding wheel, a contoller provides a control signal to the source of wheel dressing to release the wheel dressing to sharpen the grinding wheel. A method of grinding wafers includes the steps of grinding a wafer, receiving a signal indicative of the amount of grinding and controlling the release of wheel dressing in response to the signal. The controller can also receive signals from a spindle shaft speed sensor and a spindle motor current detector to determine when, and how much, wheel dressing to release.

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Model 7AG--Intelligent Wafer Grinder (Strasbaugh Literature).

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