Retention and cooling of plug-in electronic modules in a high sh

Details Retention and cooling of plug-in electronic modules in a high sh Retention and cooling of plug-in electronic modules in a high sh

1984-04-13

1985-09-24

Hart, Douglas

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

291573D, 165 46, 165 80C, 165170, 165183, 165185, 211 41, 361385, 361386, F28F 700, H05K 720

Patent

active

045427844

ABSTRACT:
Method and apparatus are disclosed for selectively clamping the edges of electronic modules into mechanical and thermal contact with a fluid coolant circuit. A stack of plural substantially parallel and generally planar fluid conduit-containing structures having spaced apart parallel legs jointly receive a stack of plural generally planar electronic modules disposed transversely therewithin. Each of the fluid conduit-containing structures includes mechanical/thermal contact pads disposed approximately perpendicular to its general plane on the inside edges of the parallel legs with the pads on some of the structures being directed one way and those on others of the structures being directed in an opposite way. At least one such set of structures is then collectively moved so as to selectively clamp the edges of the stack of electronic modules between opposingly directed contact pads. A special type of fluid conduit-containing structure formed by bonding two or more elongated sheets of spring metal along the boundaries of mating indentations is preferably employed with at least portions along one edge of the bonded sheets comprising the structure being oppositely bent up into individual and/or into pairs of spring pads to realize the contact pads just discussed.

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