Method for packaging a semiconductor die

Details Method for packaging a semiconductor die Method for packaging a semiconductor die

1995-08-16

1997-12-09

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437214, 437219, H01L 2160

Patent

active

056960336

ABSTRACT:
A method for packaging a semiconductor die includes the steps of: attaching the die to a lead-on-chip (LOC) leadframe; electrically connecting bond pads on the die to lead fingers on the leadframe; forming a glob top on the bond pads and a portion of the lead fingers; and then trimming and forming the lead fingers into leads. The glob top protects the bond pads and leads and secures the leads to the die. In addition, the glob top leaves most of a face of the die exposed. The completed package has a small footprint which matches the peripheral shape of the die. During the packaging process a support structure such as a molded carrier ring can be formed on the leadframe to facilitate handling and testing of the singulated die.

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