Substrate with multiple type connections

Details Substrate with multiple type connections Substrate with multiple type connections

1981-12-09

1984-05-08

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52H, 361403, 361411, H05K 109, H05K 118

Patent

active

044478577

ABSTRACT:
A novel substrate is disclosed which can mount either flip-chip solder bonded IC chips or wire bonded chips, or both chips, or a single chip having both solder bonds and wire bonds is disclosed. The substrate has an array of solder pads which will accept solder bonds. Those pads which are to be used for wire bonding have mounted thereon a trimetallic pedestal. Each pedestal has a layer of solder metal bonded to the solder pad, a top layer metal suitable for wire bonding, such as, aluminum or gold, and an intermediate layer of metal, such as nickel, which is impervious to both solder metal and the top layer metal.

REFERENCES:
patent: 3544704 (1970-12-01), Glenn et al.
patent: 3591839 (1971-07-01), Evans
patent: 3770874 (1973-11-01), Kreiger et al.
patent: 3778530 (1973-12-01), Reimann
patent: 3781596 (1973-12-01), Galli et al.
patent: 3809797 (1974-05-01), McMunn et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4145120 (1979-03-01), Kuboto
Gedney et al., Low-Cost Integrated Circuit, IBM Tech. Disc. Bull., vol. 20, #9, Feb. 1978, pp. 3399 & 3400.
F. W. Eurglunes, Via Hole Filling Technique, IBM Tech. Disc. Bull., vol. 12, #4, Sep. 1969, p. 596.

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