Method of preparing polyamide acid for processing of semiconduct

Details Method of preparing polyamide acid for processing of semiconduct Method of preparing polyamide acid for processing of semiconduct

1981-09-30

1984-05-08

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

525436, 528125, 528184, 528185, 528310, 528327, 528331, C08G 7310

Patent

active

044475969

ABSTRACT:
An improved method of preparing polyamide acid for processing of semiconductors from a diamine and a tetracarboxylic acid dianhydride optionally with a diaminocarbonamide, is provided (1) by reacting the components at below 40.degree. C. until the reduced viscosity reaches above 0.5 dl/g. at 30.degree. C. and then, (2) by adjusting the reduced viscosity to more than 0.3 dl/g, at 30.degree. C. and the solution viscosity to 500-3,000 cps at 25.degree. C. by heating at 50-100.degree. C. By applying the polyamide acid obtained by the method to semiconductor apparatus, they get sufficient heat-resistance without pin holes, and their reliability may be greatly improved.

REFERENCES:
patent: 3410826 (1968-11-01), Endrey
patent: 3663492 (1972-05-01), Behr
patent: 3846166 (1974-11-01), Saiki et al.
patent: 3981847 (1976-09-01), Meyer et al.
patent: 4017886 (1977-04-01), Tomono et al.
Patent Gazette-Pat. Appln. No. 44-100 883/69 Miyadera et al.

Affiliated with

Also associated with

Rating

Method of preparing polyamide acid for processing of semiconduct does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of preparing polyamide acid for processing of semiconduct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of preparing polyamide acid for processing of semiconduct will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1603565