MCM manufactured by using thin film multilevel interconnection t

Details MCM manufactured by using thin film multilevel interconnection t MCM manufactured by using thin film multilevel interconnection t

1994-08-17

1996-01-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361807, 361810, 361812, 174 524, 174259, 257700, H05K 111

Patent

active

054885426

ABSTRACT:
The multichip module includes a ceramic multilayer substrate, a thick film wiring, a thick film insulator, a thin film multilayer wiring portion and semiconductor chips. The thick film wiring and the thick film insulator are laminated on the ceramic multilayer substrate. The thin film multilayer wiring portion is formed on the thick film insulator. In this thin film multilayer wiring portion, thin film wirings and thin film insulators are alternately laminated. The semiconductor chips are mounted on the thin film insulator of the thin film multilayer wiring portion, and the chips are electrically connected to a plurality of bonding pads made of the thin film wirings of the thin film multilayer wiring portion. A thick film wiring is situated underneath each bonding pad, and the thick film wiring is electrically connected to the thin film wiring in order to serve as a part of the wiring.

REFERENCES:
patent: 4692839 (1987-09-01), Lee et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5375042 (1994-12-01), Arima et al.
"Concurrent Engineering Realization Through Multichip Module Vehicles: Technology and CAD Tool Requirements", Wyatt, K. W., IEEE/CHMT '91 IEMT Symposium, pp. 348-355, 1991.
"Microcarrier for LSI Chip Used in the HITAC M-880 Processor Group", Inoue et al., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 1, pp. 7-14, Feb. 1992.

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