Molding apparatus with shuttle and lock mechanisms

Details Molding apparatus with shuttle and lock mechanisms Molding apparatus with shuttle and lock mechanisms

1995-01-18

1997-02-18

Heitbrink, Tim

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

With product ejector

264334, 425575, 425595, B29C 4566

Patent

active

056039670

ABSTRACT:
Plastic parts are molded in an apparatus having two molds mounted on a reciprocating shuttle bed. While one mold is filled with resin at a filling position, the other mold is at an unloading position where a part cools and is extracted. The bed is then shuttled so that the other mold is at the filling position and the one mold is at a second unloading position. The molds have separable mold halves closed by a suitable driver. A toggle mechanism engages latches on the mold halves to lock the mold closed. The toggle is a pair of pivoting leaves on a transversely movable post. The edges of the leaves separate and engages stops on the latches. An extrusion head advances to the mold for filling and is withdrawn for shuttling. A part extractor is movable between the unloading positions and places the parts in a bin.

REFERENCES:
patent: 3262158 (1966-07-01), Von Reimer et al.
patent: 3327353 (1967-06-01), Eggenberger
patent: 4005964 (1977-02-01), Bishop
patent: 4273524 (1981-06-01), Smith
patent: 4432720 (1984-02-01), Wiatt et al.
patent: 4579519 (1986-04-01), Maser et al.
patent: 4588364 (1986-05-01), Schad
patent: 4594067 (1986-06-01), Langos
patent: 4608005 (1986-08-01), Hayashi et al.
patent: 4611981 (1986-09-01), English
patent: 4626190 (1986-12-01), Hellmer
patent: 4698012 (1987-10-01), Shelby et al.
patent: 4768946 (1988-09-01), Maruyama et al.
patent: 4810181 (1989-03-01), Ozawa
patent: 4861258 (1989-08-01), Margiaria et al.
patent: 4959191 (1990-09-01), Yoshioka et al.
patent: 5044927 (1991-09-01), DiSimone et al.
patent: 5055250 (1991-10-01), Schad et al.
patent: 5306325 (1994-04-01), Smith et al.

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