Silver plating procedure

Details Silver plating procedure Silver plating procedure

1983-07-11

1984-10-23

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 44, 204 45R, C25D 346, C25D 364

Patent

active

044786913

ABSTRACT:
A silver electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent silver films. The electroplating bath comprises silver complexed with an aliphatic polyamine compound with 3 to 20 carbon atoms. Particularly useful are such polyamines as diaminopropane (particularly 1,3-diaminopropane), diethylenetriamine, 1,4-diaminobutane, 1,6-diaminohexane, etc. The procedure is also useful for electroplating a variety of silver alloys. In addition, the bath is highly stable, does not adversely affect the base material being plated and does not contain hazardous materials which require special disposal procedures.

REFERENCES:
patent: 2355070 (1944-08-01), Harford
patent: 2660554 (1953-11-01), Ostrow
patent: 2666738 (1954-01-01), Kardos
patent: 2735808 (1956-02-01), Greenspan
patent: 2777810 (1957-01-01), Ostrow
patent: 4088549 (1978-05-01), Deuber
patent: 4265715 (1981-05-01), Rosegren et al.
S. R. Natarajan et al., Metal Finishing, pp. 51-56, Feb. 1971.
Proc. 8th Congress of the International Union for Electrodep. and Surface Finishing, 1973, pp. 180-186.
Design Engineering, "New Ways to Skimp on Gold", pp. 45-46, Nov. 1980.

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