Stamped circuit board

Details Stamped circuit board Stamped circuit board

1980-12-15

1983-09-06

Dixon, Jr., William R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29849, 156250, 427 96, 427276, 428158, 4283133, 4283191, 428901, H05K 102, B32B 3100, B05D 112, B32B 312

Patent

active

044031076

ABSTRACT:
A circuit board is fabricated comprising a metal layer laminated to an underlying dielectric substrate. Portions of the metal layer are separated and recessed into stable indented portions of the substrate by a stamping die, roller, or the like. The substrate is composed of a cellular material, for example, polysulfone impregnated with hollow glass spheres, whereby the indented portions of the substrate are compacted by impression of the die profile to receive separated portions of the metal layer therein.

REFERENCES:
patent: 2757443 (1956-08-01), Steigerwalt et al.
patent: 3239915 (1966-03-01), McGinley et al.
patent: 3470059 (1969-09-01), Jonnes
patent: 3506533 (1970-04-01), Berner
patent: 3628243 (1971-12-01), Phol et al.
patent: 3697668 (1972-10-01), Campbell
patent: 3873392 (1975-03-01), Niebylski et al.
patent: 3931762 (1976-01-01), Fukushima et al.
patent: 4095008 (1978-06-01), Sundstrom et al.
Haining et al., IBM Technical Disclosure Bulletin, vol. 22, No. 5, (Oct. 1979), p. 1799.

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