Method of making peripheral low inductance interconnects with re

Details Method of making peripheral low inductance interconnects with re Method of making peripheral low inductance interconnects with re

1998-09-24

2000-05-02

Beck, Shrive

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

427 98, 427307, 427357, 427 97, 428901, B05D 512, B32B 300

Patent

active

06057027&

ABSTRACT:
A method for making a circuit device having at least one peripheral interconnect for electrically connecting the device to another circuit device on a motherboard, includes forming at least one opening in a substrate, the opening having an inner surface extending between first and second major surfaces of the substrate. The inner surface of the opening and portions of the major surfaces adjacent the opening are coated with electrically conductive material. Electrically conductive material is removed from opposing regions of the inner surface of the opening prior to plating and then, after plating, the substrate is cut in a line extending across opposing regions to expose the coated and plated inner surface as the peripheral electrical interconnect. The method produces interconnects with reduced contamination by conductive particulates.

REFERENCES:
patent: 4183137 (1980-01-01), Lomerson
patent: 4521262 (1985-06-01), Pellegrino
patent: 4605471 (1986-08-01), Mitchell
patent: 4784104 (1988-11-01), Ferrier et al.
patent: 5985521 (1999-11-01), Hirano et al.
Lynch et al., Rigid Printed Wiring Board Fabrication Techniques, Electronic Materials Handbook, vol. 1, pp. 539-549 (no date).

Affiliated with

Also associated with

Rating

Method of making peripheral low inductance interconnects with re does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making peripheral low inductance interconnects with re, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making peripheral low inductance interconnects with re will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1592272