Semiconductor device having ceramic package incorporated with a

Details Semiconductor device having ceramic package incorporated with a Semiconductor device having ceramic package incorporated with a

1988-09-15

1989-10-24

Sikes, William L.

H01L 2302

Patent

active

048765880

ABSTRACT:
A semiconductor device in which a heat-radiator is bonded by a resin film to a metal plate constituting a part of a package is disclosed. Gold plating layers are employed in bonding pads, outer leads and the die bonding portion of the package. However, from the surface of the metal plate to which the resin film is adhered, the gold plating layer is removed or excluded, and the resin film is adhered to an underlying nickel plating layer.

REFERENCES:
patent: 3686539 (1972-08-01), Schwartzman
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4319264 (1982-03-01), Gangulee et al.
patent: 4611238 (1986-09-01), Lewis et al.
patent: 4829403 (1989-05-01), Harding

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