Method for making testable electronic assemblies

Details Method for making testable electronic assemblies Method for making testable electronic assemblies

1985-11-21

1987-12-08

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

324 73R, H05K 330

Patent

active

047110244

ABSTRACT:
A method for achieving printed circuit (PC) board-level testability through electronic component-level design using available technological methods to effect a state of transparency during test, allowing precise verification and diagnosis on a component-by-component basis. Applicable to a greater variety of electronic products than other test methods, and not appreciably constraining functional design, this approach inherently avoids obstacles which prevent other techniques from fulfilling their objectives. This method is applicable to analog or digital electronic components and circuits and results in the ability to largely combine component level and board level test development efforts, a reduction in the need for exhaustive component testing prior to board assembly, the applicability of a single tester configuration to a number of product types, the ability to substitute a verified component for a suspect one without removal, and the ability to detect marginally operative components which have not yet affected board functionality. This method allows the production and stocking of a single set of compatible electronic components to be used in place of existing electronic components as well as allowing existing electronic designs to be converted to this test method by substituting compatible electronic components for all existing electronic components.

REFERENCES:
patent: 3969670 (1976-07-01), Wu
patent: 4556840 (1985-12-01), Russell
IBM Technical Disclosure Bulletin, vol. 23, No. 9, Feb. 1981, pp. 4078-4079 by Jackson et al.

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